• Home
• Cooling Solutions
• Vertiv Precision Cooling
• In-Row Cooling

In-Row Cooling

Vertiv In-Row Cooling delivers a high-efficiency, close-coupled thermal management strategy engineered to keep modern IT loads stable, predictable, and fully protected. Positioned directly at the rack line, these systems capture, cool, and condition heat at the source—driving superior Delta-T control, eliminating thermal hotspots, and materially reducing bypass airflow.

Designed for high-density environments, edge deployments, and scalable white-space builds, Vertiv’s in-row portfolio integrates seamlessly with existing rack architectures and supports dynamic load profiles common in AI, virtualization, and cloud workloads. Systems leverage advanced variable-capacity components, precision airflow management, and Vertiv iCOM™ controls to optimize performance, reduce OPEX, and maintain energy alignment with operational targets.

Whether deployed as standalone units or configured in a row-based cooling ecosystem, Vertiv In-Row Cooling enables predictable thermal outcomes, faster deployment cycles, and a measurable lift in cooling utilization efficiency (CUE). The result: greater uptime assurance, improved lifecycle economics, and a right-sized cooling strategy built for today’s data-driven environments.

Core Attributes

• Close-Coupled, Rack-Level Cooling – Positioned directly at the heat source for precision thermal control.

• Variable-Capacity Operation – Scales output in real time to match dynamic IT loads and protect against thermal drift.

• Integrated iCOM™ Controls – Embedded intelligence enabling supervisory control, multi-unit teamwork, and advanced diagnostics.

• High-Density Ready – Supports modern AI, HPC, cloud, and virtualized environments requiring higher kW per rack.

• Modular & Scalable Architecture – Expand cooling capacity row-by-row without major room redesigns.

• Hot-Aisle/Cold-Aisle Alignment – Optimized airflow to eliminate bypass air and maintain predictable Delta-T.

• Energy-Efficient Design – Optimized for reduced cooling OPEX and improved CUE/PUE targets.

• Flexible Deployment – Fits both new builds and retrofit environments with minimal infrastructure changes.

Key Features

• Direct Airflow Capture & Delivery
  Pulls return air from the hot aisle and discharges conditioned air directly to the cold aisle for maximum thermal precision.

• EC Fans with Variable Speed Control
  Ensures airflow modulation based on real-time load while reducing power consumption.

• Advanced iCOM™ Thermal Control Suite
  Provides automated protection routines, predictive alarms, load sharing, and multi-unit coordination.

• Front-Service Access
  Full-serviceability from the aisle reduces downtime and simplifies maintenance workflows.

• Redundant Component Architecture
  Options for N, N+1, and higher redundancy models to ensure uninterrupted cooling availability.

• Seamless Integration with Vertiv Ecosystem
  Works with Vertiv racks, containment, UPS, monitoring, and SmartRow/SmartAisle deployments.

• Multiple Cooling Technologies
  Available in chilled water, DX, or hybrid configurations to meet site-specific infrastructure constraints.

• Network Insight & Remote Monitoring
  Supports BMS integration, SNMP notifications, iCOM CMS, and centralized data-center oversight.

Business & Technical Benefits

• Improved Uptime & Risk Mitigation
  Thermal emergencies are mitigated at the rack line—reducing hotspot risk and stabilizing the IT load.

• Higher Cooling Utilization Efficiency (CUE)
  Precision alignment reduces bypass airflow and materially improves energy performance.

• Lower Operating Costs
  Variable-capacity components and right-sized cooling reduce power draw and eliminate over-cooling.

• Faster Deployment Cycles
  Modular row-based architecture enables rapid install without large-scale mechanical redesigns.

• Optimized for AI & High-Density Loads
  Maintains thermal stability for GPU clusters, blade servers, and other heat-intensive equipment.

• Scalable Growth Path
  Add units as demand grows—no stranded capacity, no unnecessary capital outlay.

• Cleaner, Predictable Thermal Profile
  In-row placement supports tighter SLA adherence and more stable environmental conditions.

• Compatibility with Existing Infrastructure
  Ideal for retrofits or incremental upgrades without major capex or downtime.