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The Amco Enclosures Titan DT Series sets the benchmark for AI-grade data center performance. Built on a heavy-duty welded steel frame with reinforced corner posts and precision-machined rails, the Titan DT is engineered to support mission-critical compute and GPU-dense workloads. Designed for long-term infrastructure scalability, this enclosure line delivers unmatched strength, airflow management, and configurability — making it a top choice for AI server deployments, enterprise clusters, and government data facilities.
Exceptional Load Capacity — Supports up to 3,000 lbs static and 2,500 lbs rolling load, ideal for AI and GPU-intensive systems.
Precision Frame Design — Fully welded frame structure for maximum rigidity and thermal alignment under load.
Scalable Heights — Available in 42U, 45U, 48U, and 52U configurations to match your rack density requirements.
Advanced Airflow Control — Fully vented doors (front 80% open area) and split rear door design for improved hot/cold aisle performance.
Enhanced Cable Management — Tool-less vertical and horizontal routing channels for quick system integration.
Flexible Rail Adjustments — Depth-adjustable mounting rails (24”–36”) with printed U-space labels.
Comprehensive Power & Cooling Compatibility — Supports top-mount or bottom cable entry, vertical PDU integration, and overhead cooling containment.
Secure Access Design — Multi-point locking swing handles with keyed access for restricted environments.
Finish & Build Quality — Electrostatic powder-coated finish in standard black; custom colors available.
Load Rating: 3,000 lbs (static) / 2,500 lbs (rolling)
Material: 12- & 14-gauge cold-rolled steel
Rail Type: EIA-310-E compliant square-hole universal mounting
Certifications: UL-Listed, RoHS compliant, TAA compliant (Made in USA)
Cooling Optimization: 80% perforated airflow, optional fan tray assemblies, and airflow containment panels
Compatibility: Designed for high-density AI servers, blade systems, UPS units, and 1000mm deep networking gear
Artificial Intelligence & Machine Learning Compute Clusters
Edge and Core Data Centers
Enterprise and Government Infrastructure
High-Performance Computing (HPC) Systems
Network Operations Centers (NOCs)
Research and Laboratory Environments
Future-Proof Design: Engineered for next-generation hardware and AI processing requirements.
Thermal Efficiency: Reduces cooling costs through optimized airflow and containment options.
Operational Security: Reinforced door locks and cable protection for high-security installations.
Integration Flexibility: Compatible with leading PDU, UPS, and containment vendors (Vertiv, APC, Chatsworth, Legrand).
Made in the USA: Backed by Amco Enclosures’ long-standing manufacturing excellence and full lifecycle support.
Available in multiple height and depth configurations
For shipments outside the USA, contact customer service at (800)-686-5312.
Mainline can provide a detailed plan to address your particular requirements. For assistance on your Data Center Project call Mainline Computer Products for a Free Consultation & Quote toll free at: (800) 686-5312 or Email: Sales@MainlineComputer.com.
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