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    • Vertiv™ CoolChip CDU

    Vertiv™ CoolChip CDU liquid-to-liquid and liquid-to-air solutions support hyperscale, colocation and enterprise applications .

    With cooling systems consuming up to 40% of an AI data center's total energy, pumped two-phase (P2P) direct-to-chip cooling is transforming the industry with its efficiency, reducing cooling energy consumption by up to 82%.

    The increasing demand for high-performance computing (HPC) workloads has necessitated advanced liquid cooling solutions. Modern artificial intelligence (AI) chipsets now feature thermal design power (TDP) ratings exceeding 1,000 watts (W), such as the Gaudi HL-2080 at 600 W, AMD MI300X at 750 W, and the NVIDIA Blackwell GPU at 2000 W. To address the growing thermal requirements of these components, chipmakers, universities, and manufacturers like Vertiv collaborated to develop P2P direct-to-chip liquid cooling.

    Research presented at the American Society of Mechanical Engineers International Technical Conference and Exhibition (ASME InterPACK) 2024 validates the commercial viability and technical efficacy of P2P direct-to-chip cooling for high-power density chips. The system reliably manages thermal load in AI data center environments under varying conditions. Detailed performance metrics and technical specifications follow.

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